Copper Replenisher B is designed to be used alongside our Copper Replenisher A to help maintain stable bath chemistry when operating plating solutions with our platinised titanium (platinum) electrodes. During plating, the copper is replaced using Copper Replenisher A. Over time this process can gradually increase the sulphuric acid level of the solution. Copper Replenisher B provides a controlled way of moderating this increase by supplying copper in a form that reacts with excess acid already present in the bath. Used periodically alongside normal copper replenishment, it allows operators to maintain tighter control of bath acidity during extended plating runs and can significantly prolong the useful life of the plating solution. Please refer to our Calculator in the blue tabbed panel for further guidance on how much of this additive to add to keep your CopperPro Electroforming Solution working at its optimum level.
